This section describes how to load paper into the optional cover interposer.

• Load paper on the side already printed (the front side). If you are using the optional booklet finisher, load sheets print side down.

• Load paper in the optional cover interposer in the same orientation as paper in the paper tray.

• The staple or punching location will be on the left side of the paper, when you are facing the printer.

• Best video player for mac high sierra download. Do not place anything on top of or leave documents on the sensor. This may lead to the paper size not being correctly scanned or paper jams.

• When using the folding functions, the paper in the optional cover interposer must be of the same size as the prints after they have been folded. If the paper in the optional cover interposer is larger than the folded sheets, a misfeed might occur.

• Do not stack paper over the limit mark.

• Do not use paper that has already been printed onto by this printer.

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1. While pressing the release lever, align the side fences with the paper size to be loaded.

2. Load paper orderly. Tightly fit the side fences to the loaded paper.

   When loading paper larger than A4, draw out the paper extender.

• Each tray can hold up to 200 sheets of paper.

• If you load a paper size that is not selected automatically, you will need to specify the paper size with the control panel.

• When loading the optional cover interposer, be sure to load the paper in the orientation that it will be delivered.

An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.^[1]

Dvb-t2 usb driver for mac. Interposer comes from the Latin word 'interpōnere', meaning 'to put up between'.^[2]

A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II. This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible.^[1] Silicon and glass are also evaluated as an integration method.^[3][4] Interposer stacks are also a widely accepted, cost-effective alternative to 3D ICs.^[5][6] There are already several products with interposer technology in the market, notably the AMD Fiji/Fury GPU,^[7] and the Xilinx Virtex-7 FPGA.^[8] In 2016, CEA Leti demonstrated their second generation 3D-NoC technology which combines small dies ('chiplets'), fabricated at the FDSOI 28 nm node, on a 65 nm CMOS interposer.^[9]

Another example of an interposer would be the adapter used to plug a SATA drive into a SAS backplane with redundant ports. While SAS drives have two ports that can be used to connect to redundant paths or storage controllers, SATA drives only have a single port. Directly, they can only connect to a single controller or path. SATA drives can be connected to nearly all SAS backplanes without adapters, but using an interposer with a port switching logic allows providing path redundancy.^[10]

See also[edit]

References[edit]

1. ^ ^abPackage Substrates/Interposers
2. ^interposes - definition of interposes by the Free Online Dictionary, Thesaurus and Encyclopedia
3. ^Silicon interposers: building blocks for 3D-ICs / ElectroIQ, 2011
4. ^2.5D Interposers; Organics vs. Silicon vs. GlassArchived 2015-10-10 at the Wayback Machine / Rao R. Tummala, ChipScaleReview Volume 13, Number 4, July–August 2013, pages 18-19
5. ^Lau, John H. (2011-01-01). 'The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)'. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. pp. 53–63. doi:10.1115/ipack2011-52189. ISBN978-0-7918-4461-8.
6. ^'SEMICON Singapore 3D IC Wrap-Up: Bring down the cost and bring out the TSV alternatives - 3D InCites'. 3D InCites. 2013-05-22. Retrieved 2017-08-21.
7. ^'The AMD Radeon R9 Fury X Review: Aiming For the Top'. Retrieved 2017-08-17.
8. ^'White Paper: Virtex-7 FPGAs'(PDF).
9. ^'Leti Unveils New 3D Network-on-Chip EE Times'. EETimes. Retrieved 2017-08-17.
10. ^Willis Whittington (2007). 'Desktop, Nearline & Enterprise Disk Drives'(PDF). Storage Networking Industry Association (SNIA). p. 17. Retrieved 2014-09-22.